all footprints that I have found for MX switches (hot swappable) has the pads on the backside. For instance this one.
The problem is the when generating the position file, the component is placed on top layer and not at bulttom layer.
Is there a way to specify on which side the component shall be placed? Placing the footprint on back layer does not work as it is asymetrical (flipping it).
To get the PCB manufactured correctly, the footprint needs updated per the last response to put the (SMT) socket on the top layer(s) in the footprint and then flipped in the layout.
In the footprint editor, select everything and hit F (Flip) sorted it for me. If you want the 3D view to be correct, you will need to change the 3D model position manually.
OK, so it’s SMD, so you can place the footprint then go into the properties of each pad and change the layer it’s on . . . although flipping is usually the correct way to do it for an SMD part otherwise, for a non symmetrical part, the orientation will be wrong.