I created a footprint for a Torex Semiconductor XCL220 switching regulator and want the flood to connect to the power output pads but I have to manually fill it with traces to do so. I’m using solid fill, which seems to work for other devices.
I’m not sure if there is something wrong with my footprint or not.
Right now I have a bunch of traces added to fill in the area. The part is on the right side near the middle.
I just opened it up and found it was set to thermal relief, but if I set it to solid it still won’t connect to pin 8 which I want to help with thermal relief.
I’m still fairly new to doing PCBs. This is the first one I’ve sent out to be manufactured.
And use the priority setting for a zone, so you don’t have to draw all those cut outs yourself - that’s what the CAD tool is there for.
Your big ground plane just needs to be a simple rectangle over the whole board and any additional smaller copper zones just need to be bumped up in their priority, so they fill BEFORE the ones with the lower priority number are being filled.
Why did you make a normal rectangular pad a custom pad shape? Custom pads are meant for complex shapes that can not be represented any other way. (They have drawbacks. One of them is that you can not use thermals to connect to copper zones. Another is that they are more computationally expensive.)
I also just downloaded your project and the pad properties are still the same as shown by @Joan_Sparky. So it seems you have forgotten to push (last change was two days ago)
They should all be updated. CL-2025-02.kicad_mod says it was updated 26 minutes ago. It looks like a nice part too. 1A 3.3v with only bypass caps needed. I updated my project as well.