Hello all, SO I am quite new at this - and have tried searching through the forum for anyone else with a similar problem. There are a few, but none of them helped unfortunately, so here I am!
I am physically mounting a SOC-227 mosfet to a riser board - This project is that riser board. But I am having a lot of issues with the foot print and fill zone matching up. The solid one, just goes over the hole in the foot print. The therm relief set at 0 causes weird lines to go through the holes. I thought that it was just rendering artifact, but when I looked in gerbv, there were no holes at all in the design that I could see, and on top of it, there was a microscopic line around the pad where the thermal relief would be.
I should mention that I did not try gerbv with solid fill zones on
Any ideas?
