Hello everyone,
I’m new to Kicad (version 6.0.5-0) and I made an audio preamp PCB with OPA. The board will be soldered with only thru-hole components. The voltage supply here is +/- 18v.
A friend advised me to work in four-layers mode and here’s how I distributed them:
- Layer 1 (top) = audio signal
- Layer 2 = audio ground
- Layer 3 = V+
- Layer 4 (bottom) = V-
I set all the pads to F.Cu, B.Cu and connected layers and asked for thermal relief which I set to 0.5 (spoke) and 0.5 (gap).
Now for maximum RF protection I add a filled zone on layer 2 (2nd from top) which is audio GND. Then I read in Kicad doc. that a filled zone can’t be directly connected to any layer and I noticed that in the concerned layer (2) the pads & tracks are “isolated” from the filled zone. So I set one of these pads (R99) as connected to all cooper layers where I will connect the PSU ground to the audio ground.
My questions are
- Is it a good way to proceed ?
- can someone have a look at how I arranged the different layers ?
Then another point : since I will connect wires to the board I add some pads chosen in the connector wires menu but some of them refuse to be paired to the net I’d like : more precisely, the net to which I wish to associate them does not appear in the possible choices of the drop-down menu so I added some resistor’s footprints where I will able to solder my connected wires instead of putting a resistor…
Then a last point : I did not find a dedicated footprint for a TSSOP14 adapter in my footprints library so I drew one in the FP editor (U1 on the schematic) > maybe it’s because my Kicad version is not recent…
Thanx in advance for your help
Regards