first of all I want to thank you for this nice software. I am all new to this but it was quite easy for me to get started. For me it was easier to grasp than EAGEL.
Currently I am learning KiCAD to be able to do chip on board (COB) PCBs. For COB I would need an extra feature to do wire bonds and to export bond coordinates.
I picture this like that. In case you have a n-up/p-down LED die. The footprint would be simple square for p on the copper layer (current standard). For n I would need to be able to add a special “pad” on a new layer that symbolizes the top of the die. This new layer must be able to hold several pads since some dies can be connected multiple times.
In pcbnew I would need to additional functions. One that allows me to place bonding areas on the PCB. This would look like a standard footprint but without needing a component on Eeschema. Since sometimes it is possible to bond a die from different directions I do not want to add the landing pad to the footprint. The lading pad needs to be free to place. The second function would be a way to place wirebonds. Wirebonds should be addable like tracks. The wirebonds are straight lines connecting a) any top pads to any other top pad or landing pad and b) any other two pads.
Here is how I picture a print out:
The wirebonds should be handled like tracks so that all current checks still work.
- Specify thickness of bond wire
- Check loop length
- Check for max. current allowed for wire
- Table with bonding coordinates
Is this something that is possible within KiCAD? I have a little programming knowledge with Qt and PHP. If I could help implementing this I certainly would.