DRC violation: Footprint component type doesn't match footprint pads (expected 'Through hole'; actual 'SMD')

[wxE5]

This question has been asked before, but none has an answer that describes how to get rid of the error.

I have an SMD footprint that uses thermal vias:

The footprint type is correctly set to SMD:

However, kicad throws a DRC violation:

Footprint component type doesn’t match footprint pads (expected ‘Through hole’; actual ‘SMD’)

How can I get rid of the error and why does it occur in the first place? The component type is clearly set to “SMD”. Merely holes in the footprint is not an indicator of a through-hole component. There are many SMD components using holes (e.g. connectors, tag-connect pogo pads, cooling fins, etc.).

Sure, I can ignore the error, but I have to do that every time I’m using the footprint, so that’s not a good way to solve it. I’d like to fix the footprint itself so it doesn’t generate an error in the first place. How to do that? I couldn’t find “through hole” mentioned anywhere in the footprint.

Version: 8.0.8+1, release build

[mf_ibfeew]

I couldn’t find “through hole” mentioned anywhere in the footprint.

You have added 30 through hole pads in your smd footprint.
You could look into the parameter settngs for these THT pads and change their “Fabrication property” from “None” to “Heatsink pads”.

[wxE5]

@mf_ibfeew

change their “Fabrication property” from “None” to “Heatsink pads”.

Brilliant, that did the trick! Thank you so much for the quick reply.