Do I need to create a separate stencil layer for OSH Stencils?

Layout
1

I have a pcb that contains mostly through hole parts… but I do have 3 smd parts on the back of the pcb.

I am making 250 of these so I want to have a solder paste stencil made.

So the question is do I have to create a separate stencil layer?? can OSH Stencils create the stencil from the copper layer that contains the SMD devices??

If I need to create a separate Stencil layer then is that the only file layer that I need to send them?

Also if I need to create a separate stencil layer is it any different from just making regular footprint pads for smd devices??

Attached is a snapshot of the PCBNEW screen with all the layers turned off. All I want is a stencil of the green SMD pads.

HELP me OBIWAN!!!

thanks
dwight

2

Not here is Obiwan, help you I will.
Use the paste layers you must:

649×747 89.3 KB

Enabled in most SMD footprints, the paste option is:

619×502 42.2 KB

3

Thank you so much…

It was right there, all I had to do (as you pointed out) is to check to plot the F.Paste and B.Paste.

Learn I did!!!

dwight