Design rules for drill diameter for each layers

Layout
1

I am designing a 6-layer board.
The minimum drill dimensions is 0.1 mm for 1-2, 2-3, 4-5 and 5-6 layers
but only 3-4 layers is 0.2 mm.
0.1mm is made with Laser, 0.2mm is drill machine.
Is it possible to set the minimum dimensions rule the drill diameter for each layer?
I wish to use checking tool that the drilling size are correct or not correct.

2

Which Fab House has these dimensions as qualified values?

3

This is Just example. Do you need Fab House name? or Is there any problem ?

4

I haven’t used microvias, but in the Board Setup -> Design Rules there are different rules for µVias and normal vias. Your 3-4 via seems to be a normal via, not µVia. Try allowing µVias and blind/buried vias (you have probably done that already). For all 3-4 vias choose the Buried/Blind type in the via Properties. Then the normal via minimum is applied for the DRC check. The smaller minimum is applied for µVias (which can also be blind/buried by definition without saying so explicitly).

Does that help you?

5

yes, the OP is describing using uVia’s and blind/berried via’s but for Kicad to automatically choose the type (be it uVia via different diameter via’s from the predefined list) is not possible.

This might be a good idea to submit as an enhancement where zone information could be used to detail what via’s to be used automatically

6

You probably interpret the information from your PCB manufacturer wrongly.

In a normal PCB process, the manufacturing process is:

  1. Etching of the inner layers.
  2. Laminating more layers.
    2a. Repeat until all layers are laminated on the PCB.
  3. Drilling through all the layers.
  4. Plating of the drilled holes (And thickening of the two outer copper layers.
  5. Etching of the two outermost layers.
  6. Adding solder mask and silk screen.
  7. Routing and separation of PCB’s from the big panel.

I skipped the lasered micro via’s. I do not know exactly at which step those are made.

This video from 2013 is quite thorough in explaining the PCB manufacturing process.

So all layers are drilled with the same drills. There is no separate drill diameters for different layers.

Micro via’s are an exception here. These do not go through the whole PCB and are made in intermediate steps, but usually they can not connect random layers to each other and are limited by the rest of the PCB production process.

The distinction between “1-2” layers and “2-3” layers is also strange.
Normal PCB’s are made with an even number of layers. If you want a PCB with an odd number of layers, then simply all the copper of one of the layer is etched off.

There are some exceptions. For example true single layer PCB’s are still usted in high volume production for some circuits (such as mostly power supplies, and for special stuff such as PCB’s with a metal core).

7

Pretty much the same process as blind,buried, through via (just using a lazer instead of a drill) … at the stage they are required that panel is taken to the lazer machine and it does its job. That panel is then specifically plated/flashed specifically plated/flashed or copper-filled using something like Cuprostar CVF1 to complete the electrical connection and then that panel is ready to be added to teh stack to be bonded, drilled (for conventional via’s), milled (for plated slots), plated and then drilled and milled for the NPTH

the cost adds up because as the panel’s involved in the additional process need to be taken away

8

Thank you very much for good suggestions. After all, I checked with Gerber data for each layers drill diameter. Thanks a lot.

9

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