I’m new to footprint editing using KiCad, and I’m having some trouble putting together a non-standard pad for a component. The pad in question is shown here:
And a heads up: the drawing you copy is the “lead” of the package. The pads will not look the same as this would result in 0 fillet even if every measurement is at nominal. (Most likely negative fillet if any dimension has a bit of tolerance)
You should look at the suggested footprint to determine pad sizes. If there is none then you will need to rely either on industry standards or expirience
As you stated, I somehow got the package detail confused with the recommended footprint. I’ve gone with an industry standard QFN footprint, as a recommended footprint for this particular IC is not available from the OEM.