Creating a footprint with voids on inner layers

[swmcl]

I am trying to implement recommendations seen in a Texas Instruments document titled, “High speed interface layout guidelines”. In this document, there is a section that recommends creating voids on at least 2 layers below a surface mounted component that is used on high speed traces.

These voids would occur on inner ground layers in my situation.

I will try to screen shot the actual relevant section in the document.

Is it possible to create pads for components or complete footprints in Kicad that would be able to implement the TI recommendations ?

[mf_ibfeew]

Is it possible to create pads for components or complete footprints in Kicad that would be able to implement the TI recommendations ?

Yes.
.
.
.

[mf_ibfeew]

To give a more helpful answer:
In the footprint-editor you should add/create a Rule Area (keepout-zone) in the area beneath the two smd-pads.

• select inner+bottom for layer
• select tracks + copper-fill as items
  
  

[swmcl]

OK. So a keep out region on ‘inner layers’ it is !

Thanks. I’ll give it a go.

[swmcl]

Something like this then … ?

[GerardFX]

That’s fine, for such natural recomm to implement on digital high speed signals.

Nevertheless, is it possible whatever the KiCAD version is (saying 1.4, 1.5 for those still working on previous versions, or only since the 6 one)

Gerard FX