So when layout out a PCB is there an easy way to have a copper pour inside ov another pour, each tied to different nets, and have the isolated, without having to either do figure out a way to go around the inner pour?
Example… Bottom layer, have a copper pour tied to AGND under RF traces (inner pour). Next do an outer pour covering whole bottom to have DGND. When pours are updated, inner pour (AGND) is automatically isolated from DGND.