The top part represents how your clearance is expanded from the recangular pads.
The bottom part shows the resulting “no fill zone”. You can see that it creates the same little bump that you don’t understand.
Obviously the outline of the copper fill is being done by KiCAD with segments of track (thus you see half of the tracks there, other half covered by the solid fill).
@caer
You are exactly right about what happened.
Thanks for pointing it out.
I always thought that the copper will never get into the visible clearance outline.
So there is no good solution to get rid of that little bump other than manually defining a keep-out zone?
@Joan_Sparky
I was skeptical about caer’s theory until I tried the way to check the outline that you showed here. Great explanation.
On the image that you are showing here, the outline is not coming anywhere close to the pad clearance outline. Is it because you have a clearance setup for the copper pour?
The pads are from the RF capacitor that connects to a 50ohms CPW line. The impedance on the CPW line is controlled by the size of the trace and gap, assuming substrate material and height are fixed. The little bump shouldn’t matter for the frequency that I am working at. It looks cleaner when not having bumps on a RF transmission line.
Thanks for the help!