Hi,
I’ve created a thermal area as shown, As I’ve used “unspecified” I don’t have a connection, which is the first problem.
I’m also unsure how to add a mask to the area?
Thanks!
Andrew
Hi,
I’ve created a thermal area as shown, As I’ve used “unspecified” I don’t have a connection, which is the first problem.
I’m also unsure how to add a mask to the area?
Thanks!
Andrew
This area isn’t really doing much as it is, but I was intending to make an area on the bottom layer and connect it for thermal transfer. My thought here was to use a ton of vias. Is there a better way?
I’ve resolved this myself by;
Duplicating the footprint and attaching pin 4 to net.
Creating a bottom plane and then tracking from the net into the area (otherwwise it won’t fill) and applying several vias. This way the areas are stitched. All good!
As long as the device you are using has pin 4 either isolated or internally connected to pin 2 this should work. (And on your schematic you now have documentation of what that pin 4 is connected to for future troubleshooting.)
Above looks good, you could consider also vias in the paste areas ?
If this is not a radiating signal pad, you could also expand the fIll, and include fills across the whole PCB
Even not-same-net fills can help cooling, as they spread the heat over a larger area.
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