I suspect you can’t . . . but you could create a footprint with a “via” (through hole pad) of the correct size and then add a SMD pad on top of the larger size. I know it’s a workaround but it should work.
@Ram_m17 What is your goal for wanting smaller annular rings on inner layers?
Annular rings on via’s exist mostly because of drill tolerances. The idea is that even with a tolerance the side of the drill will still be inside the annular ring.
If there is no track connected to the via at a particular layer, then there is also no need at all to place an annular ring on that via.
In KiCad you can easily remove annular rings for unused pads. with PCB Editor / Tools / Remove unused Pads.
Also, removing these does not have any negative impact on the production process. It just took years for people to realize that you can easily remove them, and for software to support that function.
Removing annular rings does have significant advantages, because more room is left open on the inner layers to route tracks. This is especially useful with big DIP packages or long connectors, where the amount of tracks you can route between the pins is a limiting factor.