I am using Kicad 6.01. Probably missing something obvious here!
I have a copper fill that is specified to use thermal reliefs, which work as expected on fill.
I have a single pad where I would like to override the thermal relief and have a solid fill. So I have gone:
Pad Properties>Clearance Overrides and Settings>Pad Connection
and changed this to “Solid”. For testing, I have also tried leaving as “thermal relief” and changing the spoke width and clearance.
Nothing I do changes the connection from the default that is set for the zone (including after a “refill” command). What am I missing?