Board setup: what are CORE and PREPREG?

What is meant by CORE and PRE PREG ?
Which one is better for designing

As usual, an Internet search will provide you with the answers:

There are links there to more detailed information. Contact your manufacturer for clarification if you are intending to order. I don’t think all combinations of layers are valid.

The other thing…by the question I (and also probably @retiredfeline) assume that you do not have a lot of experience with multilayer pcbs.

If that is the case…be aware that the boards which I have designed for myself have all used the default layer stackup in 2 (not much of a stackup there) or 4 layers.

In a 4 layer board, the dielectric separating layers (1 & 2) and (3 & 4) is relatively thin, such as 7 mils. The dielectric between layers 2 & 3 is usually thicker. This is good for limiting crosstalk on the top layer when ground is on the next layer down.

There can occasionally be reasons to deviate from these defaults, but it seems unlikely that you would have a reason.

Mainly:

  1. Try to keep one layer as a reasonably solid ground if you can do so.
  2. With most tracks and footprints on the top layer, that ground layer would usually be the next layer down (layer 2 on a 4 layer board.)

Don’t mind those settings too much. Usually you select a stackup the manufacturer has readily available before uploading your desing files and those settings in the board setup are more for your own reference.

Besides the information given by retiredfeline and BobZ here’s an example of a 6-layer fabrication.

Edited your title to be more useful for future searches.

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