Hello, I’ve been trying something touchy and I wanted some help.
I’m designing a board that is connected on the bottom by being in contact with 30 pogo pins.
Since I want to have the bottom layer to only have a gnd filled area, I want the signal from the pogo pins to go on different layer but absolutely not on the top layer since there is a other big connector there.
What I’ve been conclude is that I need Blind via from the bottom layer to the internal layer with an SMD pad on it.
But I wonder if the SMD pad will be drilled? (I hope not)
Is the structure gonna resist the stress from the pogo pin?
Is my footprint configuration the right one?
SMD Pad; Coper layer : B.Cu ; Technical layer : B.Mask only (Is B.Paste usefull? I dont really understant)
-Via Blind/Burried : Start : B.Cu ; End InX.Cu
It always look like, I’m gonna have a hole in my SMD pad
Is it possible to have a via hole full?
I know I have a lots of questions that may be not clear and I am not sure about the upload of the picture…
You probably need to check with the company that you plan on having the board manufactured at. Probably any hole that doesn’t go all the way through will raise the price. Maybe considerably.
Like hermit says, study what your preferred board manufacturer can do, and especially what it will cost! And compare different manufacturers.
Most manufacturers can do filled vias as well as overplated filled vias, but it is very likely to cost significantly more, especially if only few boards are made. In runs of 10k to millions it might be worth it if some other important design benefit is acheived through it.
If it doesn’t make a big difference, offset the via from the pad and test point, and manufacturing will most likely be simpler and cheaper.
But then again, I have only looked at the manufacturers websites for their capabilities, and haven’t actually had a board with these kinds of features made for me.
