Appreciate the responses!
Basically, we have very little real estate to work with.. I'm trying to maximize the size of the rectangular pad because it has to mate with a contact on another part. Extremely small parts, so I don't want to reduce this surface area with the through hole via there.. You make a good point with blind via expenses, so I think just moving the through-via out of the way and connecting with another trace is the way to go, especially if it's standard practice.
I'm editing a file that has the through hole vias from which some boards were made, but we realized we needed blind vias (or each via moved to another location) so the manufacturer just made blind vias by editing the Gerber files I'm assuming. I don't have his files but we now have parts with these blind vias, but I'm now revising the part and trying to replicate that change for the next iteration.
And I now realize boards have even layer counts typically and checked the layer setup options immediately after saying that. Oops.