Hello everyone. I am new to the forums and have been trying to wrap my head around something. I am designing a 4 layer board that needs to handle a lot of power. It also has conditionally connected traces on different layers. I have designed some high power jumpers but am having a hard time making them in KiCAD. The jumper is basically a 15x15 array of small solder pads with blind vias in the center that tie to the respective layer. Every other pad is connected to a different layer and when the entire area is soldered, it bridges the pads making a jumper.
I can’t seem to find a good way to make a pad with a via in the center of it. A possible solution would be to make a footprint as a through hole with a rectangular pad, but then there would be a hole in other traces where every bit of ampacity is critical. Does anyone have any ideas on how a blind via in a pad could be achieved?