Blind Via Inside Pad?

Hello everyone. I am new to the forums and have been trying to wrap my head around something. I am designing a 4 layer board that needs to handle a lot of power. It also has conditionally connected traces on different layers. I have designed some high power jumpers but am having a hard time making them in KiCAD. The jumper is basically a 15x15 array of small solder pads with blind vias in the center that tie to the respective layer. Every other pad is connected to a different layer and when the entire area is soldered, it bridges the pads making a jumper.

I can’t seem to find a good way to make a pad with a via in the center of it. A possible solution would be to make a footprint as a through hole with a rectangular pad, but then there would be a hole in other traces where every bit of ampacity is critical. Does anyone have any ideas on how a blind via in a pad could be achieved?


I’m sorry. I feel like a complete idiot. I was simply working on the wrong layer during my testing and could not place the via because of that. The Vias can be placed directly in the center of any pad.