Hey everybody!
I’m designing a breakout for this MAX98390 DSP Audio Amp.
It’s a BGA chip with .4mm spacing.
Under OSHPark design rules for 4 layer boards, I can’t put a Via here or get a trace out.
I think I can change the settings to get a Via on this Reset pin but I’m here for advice 
Is there anything I can try to get this E4 - RESET pin routed out from under the chip?
Can I shrink those red circles? I’ve tried but not sure if I should do this.
0.4mm BGA is quite fine pitch. You probably need a better board house.
I have these settings for Kicad’s 4 Layer Board Design Rules, had anybody tried lowering anything with success?
Hoping to stick with Oshpark if possible but who else do you guys recommend as a board house in the USA that would allow micro vias?
Figured out how to do it with Oshpark here.
This will allow me to make some boards and test the circuit for the lowest cost.
That’s a 1mm pitch BGA. Whole different ball game.
If you just want to test, buy the evaluation board. Or get one of these: http://www.proto-advantage.com/store/product_info.php?products_id=4000019
Totally possible with Oshpark.
After searching I came across multiple people working with 0.5mm BGA successfully with using 0.101mm traces.
You can find the Kicad design file for this project and another one:
If you want more examples just search Twitter for “Oshpark BGA”
I got it done:
0.5mm is not 0.4mm. But knock yourself out, it’s your time/money.
It’s already done
lol you’re just getting started
Yea, I’ll be sure to post back to let you know how the reflow goes.
Certainly going to need a stainless stencil for this.
0.5mm pitch is the smallest I’ve done so far.
Plenty of other people successfully soldering these on hotplates from what I have seen.
You can also try this:
Ahh Yes, I follow Greg on Twitter
He does some amazing stuff!
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