Adding keepout area to footprint

I would like to make footprints like this SMP connector. I can create the two SMD pads (rectalnel for the middle conductor, custom for the outer shield, through holes for the vias), but I have a problem figuring out how to set up the pads for the shield. They are all pad number 1, connection to copper zones is set to “solid” for all shield pads, and “use pad convex hull” for the custom pad. However when I connect them to a copper fill, it fills the inside of the shield connector as well, not just the convex hull of the part. As the image shows, both pads are fully connected.


As for the topic title, not possible in v5. For the development version see Post-v5 new features and development news.

Thank you very much, I’ll try updating to the dev version!

As long as you remember it’s still unstable, may crash and even loose your data. Save often and keep backups.

Plus basically no docu and no way back. Is it a good idea to use a nightly build version?

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