Hi, I am making an SMT Layout using a standards SSOP-20 package. I notice that when I made the layout several of the pads connect directly to the ground plane, with no thermal relief. How do I add thermal relief to these pads so that they will solder correctly? Here is a picture of the layout:
There’s option for that in the zone’s preferences, footprint’s preferences and pad’s preferences. The latter overrides the former.
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