5.99 Micro via's and embedded passive's inside a footprint

I have a use case where I need to include a micro via and embedded passives into a footprint. Does anyone have any suggestions on how to do so using Kicad?

I am using 5.99 and I’ve been thinking about the micro via in particular. I understand 5.99 supports more flexible pad stacks. I think I understand that some attributes (ie: layer) can be changed manually by editing the footprint file directly. So, that would allow me to add an SMD pad and then edit the footprint file to change the layer of the SMD pad to an internal layer. However, there is no manner in which to add a manual hole and specify which layers the hole penetrates. Or, can this be done manually as well?

Vias can’t be used in footprints and holes are through holes. At the moment the padstack support means that it’s possible to choose where the annular ring is added:


I think this is natural because microvias just aren’t part of footprints usually.

If you need to keep a footprint and a via connected, you could try creating a Group for them. That way they at least won’t be separated by accident.

Thank you for the feedback. Do you know if the api for the pad stack supports holes that are not through holes?

You can try to find more information here. There are quite many links there to read, but if you don’t find anything directly about blind/buried holes, you can add a comment.

I saw that issue yesterday but I only did a cursory review. I will take a closer look. Thank you.

Under “Pad Stack Support” (https://gitlab.com/kicad/code/kicad/-/wikis/KiCad-Future-Versions-Roadmap#pad-stack-support) there is mention of a draft technical specification. Do you know where this file is located in the repository?

@Qbort has written one document: https://gitlab.com/kicad/code/kicad/-/issues/2402#note_386723536

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