On my first iteration I used 0.25mm pad width for a 48 lead LQFP package with 0.2mm lead width and 0.5mm pitch.
I used a stencil and hot air station and I encounter bridges. I was able to use solder wick to fix it, but I'd rather not have to do that. This is the my first stencil and hot air, so maybe it's just my technique.
I'm considering to decrease the pad size to 0.2mm for next iteration of the board.
Asking all of you with more experience: Is it a bad idea to decrease pad size from 0.25mm to 0.20mm and hence increase gap from 0.25mm to 0.3mm to prevent bridging?
The part in question is CMedia CM108B (package info on page 22)
Interestingly, I found a slightly different info (0.27mm lead on page 12) for the same chip here: