I am trying to figure how to get a via that is going to be connected to a ground layer to have some thermal relief. The reason I am asking is that the printer we have at our school only does holes it doesn’t have through hole plating. So for each VIA I have to connect it manually from the bottom to the top by adding a small wire in the VIA itself and then soldering it from the top and the bottom. Now some VIA on my board for some reason didn’t come out with thermal padding, actually I think the only ones that didn’t do that were the ones that were connected to the ground plane.
This makes it hard to solder because I have to heat up the whole ground plane around the VIA for me to get the solder on it, and sometimes because its open the solder just leaks every where.
I was hopping if someone could help me with this and tell me how I can manually add thermal relief for those VIAs.