Do a web search using the terms “BGA escape routing” and “BGA breakout”. You’ll find lots of articles and tips, both from EDA and semiconductor companies.
1 Like
In what you show there is via hole = 0.4mm and via diameter = 0.8mm. It is typical signal via I am using at my PCBs (hope you remember that I have written - I never used BGA). The minimum I use at thermal pads (rectangle pad under IC thet you connect by many vias with GND on the other side) is 0.6mm via with 0.3mm hole. But it is not the minimum PCB manufacturer near me (in the same town) specifies. His minimum would be 0.5mm via with 0.2mm hole. And I think that if I had to use BGA it would be my first shot in via dimensions. But this PCB manufacturer offers no more than 8 layers and I know that PCB with more then 20 layers exists so probably also smaller vias are common.
And may be you can use micro-vias. As I know these are vias going from external layer only to first layer under it and can have very small diameter. Never used, never was interested in it so I’m even not sure in what I have said. I understand (but not sure) that under such micro-via you can freely go with track on the third from top layer (this via touches only top and first layer under top. I suppose that micro-via PCB technology was developed because ICS began to have BGA cases.
This topic was automatically closed 90 days after the last reply. New replies are no longer allowed.