I am also new to this, first let me get detailed answers you asked with documents, will share those details and then start working on this.
Thanks, uv
it is new version for footprint design.
A link to load the old version on 2007, check on page 14 section “3.2.4 Glue Aperture Chip Component”
3.2.4 Glue Aperture Chip Component The glue stencil
is typically 0.15 - 0.2 mm [5.9 - 7.9 mil] thick. The glue
aperture is placed in the center of the component solder
lands. It is 1/3 the spacing between lands and 110% of the
component width (see Figure 3-11).
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