Not you it would seem.
Just to be clear, this process is only applicable to double sided boards.
Not only would this strip the copper from one side and deposit it on the other, but the holes are first filled with carbon thereby forming connections between the two sides of the board which would result in not electroplating anything at all, at least not until you burned out all the carbon. The entire board is at the same potential, it is the cathode. The tank walls or another anode in the tank, is at the other potential.
10 mil is still pretty big for via in pad. The OP's pads are not that fine pitched but are still less than 14 mil wide.
Your suggestion is only applicable to double sided boards, but double sided boards are generally not used for anything that would be considered "high density" so there would be very little need for via in pad in the first place. As has already been said, if the op wasn't home etching/drilling his board then adding vias to the ground plane would have been recommended, but he has plenty of room to add them without resorting to via in pad.