I have a comment about the last sentence in the FAQ.
For the internal layers, dropping a via on the associated net will do the same as a THT pad.
[soap-box=“SembazuruCDE climbs on his soap box and expounds:”]
Yes, there is a categorical and functional difference between vias and THT pads:
- Vias are intended only to pass a signal between layers.
- THT pads allow a component lead to be attached through the board and conveniently can connect to any layer. (In KiCad with it’s limited padstack capability the THT pad will connect (provide an annular ring) to all layers.)
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That said, I don’t think the scope of this FAQ entry covers the differences and similarities between vias and THT pads, so simply mentioning both would be appropriate. Without mentioning vias you can confuse users who are designing a fully SMT board that they will need to unnecessarily put a THT component (even just a THT testpoint) where dropping a via is all that is needed.