Hi all
I tried to find a guide for this but was not so successfull as i hoped
Anyone that has used elecrow before and can post screenshots of how the design rules are set up?
gerber generation is not the issue for me
using v5 of kicad
Hi all
I tried to find a guide for this but was not so successfull as i hoped
Anyone that has used elecrow before and can post screenshots of how the design rules are set up?
gerber generation is not the issue for me
using v5 of kicad
From https://www.elecrow.com/pcb-manufacturing.html
Multi Layers | 1-2-4 |
---|---|
PCB Material | FR-4 |
Available Color | Green, Red, Yellow, Blue, White, Black |
Silk Screen | White, Black (For White Solder Mask only) |
Maximum Size | 45cm X 120cm |
Minimum Qty | 10pcs |
Board Thickness | 0.6mm,0.8mm, 1.0mm, 1.2mm, 1.6mm |
Thickness Tolerance (t≥1.0mm) | ± 10% |
Thickness Tolerance (t<1.0mm) | ± 0.1mm |
Insulation Layer Thickness | 0.075mm–5.00mm |
Minimum PCB track | (Recommend >8mil) |
Minimum Track/Vias Space | 6mil (Recommend >8mil) |
Minimum pads Space | 8mil |
Minimum silkscreen text size | 32mil |
Out Layer Copper Thickness | 1oz(35um) |
Inner Layer Copper Thickness | 17um |
Drilling Hole (Mechanical) | 0.3mm—6.35mm |
Finish Hole (Mechanical) | 0.8mm—6.35mm |
Drill Diameter Tolerance (unplated) | 0.05mm |
Drill Diameter Tolerance (plated) | 0.1mm |
Outline Tolerance (Mechanical) | ±0.20mm |
Aspect Ratio | 8:1 |
Solder Mask Type | Photosensitive ink |
SMT min Solder Mask Width | 0.2mm |
Min Solder Mask Clearance | 0.2mm |
Solder Mask Thickness | 15um |
Surface Finish | HASL, HASL (Lead Free), ENIG |
I am convinced that the minimum plated through hole size is 0.3mm (After reading the eagle dru file) -> This means the minimum via drill size is 0.3mm.
yep but things are called at little different in kicad and that is what confuses me badly
i found an old guide for kicad but the screeenshots in that did not look anything like in v5
“Clearance” is “space between”, is there anything else? Change the net class clearances to 8mil (0,2032mm) minimum, otherwise they seem to be OK. You don’t need µVias, I think. You have to take care that each footprint doesn’t have too small pad-to-pad clearance.
EDIT: some track widths are too narrow, too.
got you on the net class clearance
but you say track widths are to narrow? do you have the diff pair in mind? because those are the only ones i can see that are under 0,2032mm
Sorry, my bad! I don’t know what I was thinking. Well, the time was 1AM…
hehe, same thing happens to me, some times yo just cant let go from things and get tired and then mistakes happen
Elecrow can actually do better than the specs they publish, it’s worth checking with them if you are getting to the limits and asking them what they’d prefer. For instance I had issues getting no solder mask between some fine pitch pads (which means they often bridge during reflow). After a bit of back and forth the minimum width of solder mask they can do is 0.15mm and you need 0.075mm either side of the pad. So for, eg, 0.5mm your max pad size is 0.5 - 0.15 - 0.075 - 0.075 = 0.2mm. They also said they prefer if I want minimum pad clearance to specify it as 0 and they’ll increase it to the minimum, instead of specifying the 0.075.
All the boards I’ve had done since then I’ve spec’ed this way and I have had solder mask where I needed it.
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