Both questions have been asked before. Here’s one hit for Q1:
Actually there are 3D models for the ICs, you have to look in the Packages_DIP library for DIP footprints for example, but of course no “printing” on the IC, just the body and legs.
Q2 is harder and you’d have to be willing to generate a new 3D model for each value. Similarly if you want “printing” on the ICs.