(kicad_pcb (version 20210722) (generator pcbnew) (general (thickness 9.4) ) (paper "A4") (layers (0 "F.Cu" signal) (1 "In1.Cu" power "GND-plane") (2 "In2.Cu" signal "Signal-1.Cu") (3 "In3.Cu" power "VCC1.Cu") (4 "In4.Cu" power "VCC2.Cu") (5 "In5.Cu" signal "Signal-2.Cu") (6 "In6.Cu" power "VCC3.Cu") (31 "B.Cu" signal) (32 "B.Adhes" user "B.Adhesive") (33 "F.Adhes" user "F.Adhesive") (34 "B.Paste" user) (35 "F.Paste" user) (36 "B.SilkS" user "B.Silkscreen") (37 "F.SilkS" user "F.Silkscreen") (38 "B.Mask" user) (39 "F.Mask" user) (40 "Dwgs.User" user "User.Drawings") (41 "Cmts.User" user "User.Comments") (42 "Eco1.User" user "User.Eco1") (43 "Eco2.User" user "User.Eco2") (44 "Edge.Cuts" user) (45 "Margin" user) (46 "B.CrtYd" user "B.Courtyard") (47 "F.CrtYd" user "F.Courtyard") (48 "B.Fab" user) (49 "F.Fab" user) ) (setup (stackup (layer "F.SilkS" (type "Top Silk Screen")) (layer "F.Paste" (type "Top Solder Paste")) (layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01)) (layer "F.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 1" (type "core") (thickness 1.3) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02)) (layer "In1.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 2" (type "prepreg") (thickness 1.3) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02)) (layer "In2.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 3" (type "core") (thickness 1.3) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02)) (layer "In3.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 4" (type "prepreg") (thickness 1.3) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02)) (layer "In4.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 5" (type "core") (thickness 1.3) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02)) (layer "In5.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 6" (type "prepreg") (thickness 1.3) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02)) (layer "In6.Cu" (type "copper") (thickness 0.035)) (layer "dielectric 7" (type "core") (thickness 1.3) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02)) (layer "B.Cu" (type "copper") (thickness 0.035)) (layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01)) (layer "B.Paste" (type "Bottom Solder Paste")) (layer "B.SilkS" (type "Bottom Silk Screen")) (copper_finish "None") (dielectric_constraints no) ) (pad_to_mask_clearance 0.0635) (aux_axis_origin 40 100) (grid_origin 0.31 0.38) (pcbplotparams (layerselection 0x00310fc_ffffffff) (disableapertmacros false) (usegerberextensions true) (usegerberattributes false) (usegerberadvancedattributes false) (creategerberjobfile false) (svguseinch false) (svgprecision 6) (excludeedgelayer true) (plotframeref false) (viasonmask false) (mode 1) (useauxorigin true) (hpglpennumber 1) (hpglpenspeed 20) (hpglpendiameter 15.000000) (dxfpolygonmode true) (dxfimperialunits true) (dxfusepcbnewfont true) (psnegative false) (psa4output false) (plotreference true) (plotvalue false) (plotinvisibletext false) (sketchpadsonfab false) (subtractmaskfromsilk true) (outputformat 1) (mirror false) (drillshape 0) (scaleselection 1) (outputdirectory "Gerbers/") ) ) (net 0 "") (net 1 "GND") (net 2 "PA17") (net 3 "PB3") (net 4 "PC12") (segment (start 79.1 90.365) (end 79.6 89.865) (width 0.64) (layer "F.Cu") (net 1) (tstamp 45668593-720e-4139-8636-9374283e547a)) (via (at 79.6 89.865) (size 0.400002) (drill 0.4) (layers "F.Cu" "B.Cu") (net 1) (tstamp 84bb7819-eb31-4b54-80a0-cae32fdd9b6f)) (segment (start 81.69 89.845) (end 81.69 89.845) (width 0.42) (layer "F.Cu") (net 2) (tstamp 135b8d91-f0c6-4034-aa69-b36ddde27de8)) (via (at 81.69 89.845) (size 0.200002) (drill 0.2) (layers "F.Cu" "B.Cu") (net 2) (tstamp a3533445-dbaa-401c-9c4f-fd438f49f35a)) (segment (start 81.69 89.845) (end 81.69 89.845) (width 0.42) (layer "In2.Cu") (net 2) (tstamp 00000000-0000-0000-0000-000060f8a263)) (segment (start 81.69 89.845) (end 81.69 89.845) (width 0.42) (layer "In5.Cu") (net 2) (tstamp 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