Hiee everyone,
I am a Hardware Engineer and also a PCB designer.
I am using a Microntroller which is in CHIP PACKAGE.
So in order to connect our microcontroller with my PCB, i am using WIRE BONDING TECHNOLOGY.
So, Can any one suggust
Q1. which type of wire bonding is the best among this Ball Bonding, Wedge Bonding, Compliant Bonding technique’s?
SPECIFICATIONS:
I. Size of Microntroller - 3.6mm X 3.6mm
II. Thickness Of Microcontroller - 200um
III. Low Power Application
Q2. How to design foot print for PCB designing according to choosen wire bonding technology ?
Can any suggust a better Websites or Pdf Link’s etc.. about wire bonding technology.
Regards,
Anirudh THABJUL
Lansa Diffusion, Paris, France