Here is another updated version of the footprint which shows User.Drawings layer. I had included F.Fab and F.Courtyard layers. Previously, I just had the F,Silkscreen layer. F.Fab layer is grey rectangle. F.Silkscreen is yellow rectangle and F.Courtyard is pink rectangle. F.Fab indicates the actual dimensions of the component.
the author mentions that the gap between silkscreen and courtyard is 0.5 mm and that is for THT components. For SMD components, it is about 0.25mm and be further lower. Perhaps the tutorial can be updated to include info about spacing in footprints of SMD components.
For SMD Components, courtyard clearance ( courtyard excess ) is below:
Typical Courtyard Allowances
Clearance Type
Allowance
Default Standard Clearance (Cw)
0.25mm (SMDs) 0.5mm (Thru-hole)
Placement Clearance
0.1mm
Fabrication Clearance
0.1mm
Source:
I had included the space between silkscreen and courtyard for SMD components as 0.25mm. If I include space from the body of the component to courtyard, it is 0.25 + 0.11 mm which is about 0.26mm.
Here is another diagram with distance between copper pads and Silkscreen at 0.26mm as per recommendations of KLC guidelines. Distance from the Silkscreen is measured from edge of the line rather than the center of line. Silkscreen thickness is 0.12mm and Courtyard thickness is 0.05mm. Distance from Courtyard is measured from center of the line. The courtyard is at 0.5mm from the grey rectangle boundary which is beyond the minimum for courtyard excess of 0.25mm for SMD components. I wonder if placing the boundaries beyond the minimum is acceptable or is it better to keep the distance between Courtyard and boundary of the component just above the minimum.
