Do I understand it correctly that this “aspect ratio” is not for the stencil itself, but for the solder paste apertures?
I guess that such a function is better added to: Footprint Editor / Inspect / Footprint checker. Thinking about this, I guess that an option to check for rounded corners in solder mask apertures would also be a nice addition for the Footprint Checker.
But when the Footprint Checker gets more functions, and functions that not everybody would want to implement, then adopting the same system that is now used for both ERC and DRC would be a logical step.