I have a 2 sided board that has multiple diff pairs but no matter how I reroute it I always seem to end up crossing over at least one of them. One option I know is to but one device on the underside of the PCB, but in my case I am unable to put any device on the back.s I need to use VIAs to do a cross over.
Is there a recomended technique/layout to do this ??
and can I use microvias ??
First thought 4 layer board with internal ground planes? Depending on the size of the from the usual overseas fab houses are comparable to 2 layer these days.
I agree with @Docara, if impedance is important, a relatively unbroken ground plane is almost essential. Tracks can cross pairs, but should do so at right angles.
I was refering to the need to swap over the tracks that form a diff pair - not other tracks crossing the diff pair. What is the recomended method/layout and should I use vias or mirco vias ??
I am stuck with a two layer board and with no devices on the backside.
If not tracks crossing the diff pair then what needs to swap over them?
I have never used micro vias, but according to what I have read micro-via is the very short via from top (or bottom) layer to the nearest internal layer. So the subject of micro vias starts in theory from 4 layer boards, but practically probably from 6 layer boards.
Sounds like the OP thinks they can form some sort of BUSS out of it somehow. Actually some kind of interchange between the busses. So yeah. Very confusing.
If this is simply flipping +/-, then using vias works at speeds up to around 10 MHz. More timing and skew critical pairs like USB3 and HDMI are not compatible with 2 layer boards
Just add a zero-Ohm resistor in series with one signal and route the trace under the resistor. You could add a second resistor to balance out the effect of the resistor.
I have seen a dedicated smd part to do the cross over. Don’t remember the details.